Project and solution highlights
Gentle and reliable gripping
The application: during the production process, the wafers have to be constantly and reliably picked up and transported through the various production steps. This demands speed in order to keep the production costs of the modules as low as possible. Gentle handling is also required as the wafers must not break.
The challenge: the more the wafer production process progresses, the more refined the wafer is and the more valuable it becomes. Having the suitable gripper technology at the right moment is therefore essential for handling the workpieces as well as for reducing investment and energy costs for the machines.
Gripping with Bernoulli grippers OGGB
The Bernoulli gripper OGGB picks up the wafers with almost no contact and reliably repositions them. In contrast to vacuum suction cups, the Bernoulli suction cup works with pure compressed air. This air is forced outwards through a tiny ring-shaped gap, resulting in a suction effect that lifts the wafer gently but reliably and doesn't leave any residue on the wafer.
Gripping with vacuum suction insert OASI
The suction insert OASI provides protection against sucking in and breaking fragile workpieces. In combination with the suitable vacuum suction cup and vacuum generator, this is a complete solution for reliably picking up and checking wafers. This low-cost solution is ideally suited to handling raw wafers, for example for a loading station at the beginning of a cell production line.