Fast and safe conveyance of wafers and solar cells
H-gantry with Bernoulli gripper OGGB
The high-speed H-gantry EXCM is fast, precise and compact.
The sensitive wafers are gently transported in combination with the Bernoulli gripper OGGB for low-contact gripping.
This process is extremely safe and is economic in its compressed air consumption.
Smooth movement into the end position: this protects not only the sensitive wafers
Standard cylinder DSBC
The DSBC with its self-adjusting pneumatic end-position cushioning PPS adapts perfectly to changes in load and speed.
- Correct cushioning reduces wear.
- Self-adjustment saves time.
Complete mounting plates for the control cabinet during wafer cutting: assembled, with all tubing and wiring fitted, checked and documented
Individually created for your application.
This saves you time and installation work.
- Handling systems
- Control cabinets
- Mounting plates
- Product modules