For these environments, we offer innovative solutions for precisely controlling media, gently handling wafers and precisely regulating forces, pressures and motion profiles. The focus here is on minimised particle generation, high process stability and efficient integration. You can automate and scale your processes safely and efficiently with Festo, whether for raw substrates, reticles/SMIFs, FOUPs, completely processed wafers in advanced packaging applications such as flip chip and hybrid bonding or die banks.