The increasing demand for ever smaller, highly developed semiconductors and chiplets is forcing manufacturers to work in inert or non-reactive environments throughout the entire production process. The extremely small lithographic structures and the thickness of the atomic layers on the wafers would be destroyed on contact with oxygen. This is usually prevented by nitrogen purging of front opening unified pods (FOUP) or other production systems with particle-free, ultra-high purity nitrogen gas (UHP). This protective measure has been the industry standard for decades, as nitrogen can be separated from the air in large quantities. The demand is enormous – and so is the potential for savings. So if you want to leverage potential savings, then the precisely dosed use of nitrogen in the production of semiconductors is an obvious choice.

Although reducing energy and carbon dioxide emissions may seem like a minor matter for you and many other manufacturers while you are busy trying to cope with the enormous demand, volumeit is worth keeping an eye on reducing energy and carbon dioxide emissions. Lower nitrogen emissions per wafer produced and the reduced amount you have to produce as a result, help you to increase the yield, as the compression and cooling processes in the production of UHP nitrogen consume a lot of energy.

You can also save energy in production, for example by using energy-efficient components. A sustainable reduction in power consumption also results in components heating up less, and therefore a lower cooling requirement for the cleanroom. Your company's CO2 footprint can be significantly improved with reduced emissions and sustainable production methods.