Automation solutions play a key role in atmospheric conditions in semiconductor production. These include processes such as applying and removingphotoresists (photoresist coating and strip), cleaning processes and CMP. In addition, numerous handling and logistics processes must be highly automated and reliable.
For these environments, we offer innovative solutions for precisely controlling media, gently handling wafers and precisely regulating forces, pressures and motion profiles. The focus here is on minimised particle generation, high process stability and efficient integration. You can automate and scale your processes safely and efficiently with Festo, whether for raw substrates, reticles/SMIFs, FOUPs, completely processed wafers in advanced packaging applications such as flip chip and hybrid bonding or die banks.