Join Festo experts for a focused expert talk addressing key challenges in semiconductor wafer and panel handling, from clamping and movement to vibration reduction and controlled motion. The sessions combine real customer issues with practical solution insights.

Morning Session – Wafer & Panel Clamping Focus: Precision handling of warped wafers and panels

• Key customer challenges in wafer/panel clamping
• Festo solution approach using the WWC Basis Kit
• Introduction to piezo technology for high‑precision applications

Midday Session – Wafer & Panel Movement Focus: Stable and controlled movement during processing

• Common movement challenges in semiconductor applications
• Pin Lift Basis Kit overview
• Flow and pressure control solutions, including:
  VEAA, VEAB, VTEP, VEFC, VTEM

Afternoon Session – Controlled Motion & Vibration Reduction Focus: Improving accuracy, stability, and yield

• Vibration reduction strategies in sensitive processes
• Controlled motion concepts for semiconductor equipment
• Solutions featuring VESC and related motion control products

What You’ll Gain

• Practical insights into real semiconductor customer challenges
• Application‑driven solutions for wafer and panel handling
• A clearer understanding of precision control technologies from Festo

Wafer warpage solutions

Application area:

As semiconductor processes advance, wafer and substrate warpage often occurs in metrology, wafer bonding, and advanced packaging. Although contact (pressing) solutions exist, they face limits in space and process needs. Festo offers a new non-contact solution.

This solution combines Festo digital and piezo technologies for precise pressure control. We also work closely with customers to develop complete solutions, tackling warpage challenges together.

Highlights of application:

• Proportional pressure control valve terminal VTEM/VTEP (positive and negative) and Festo patented control technology for precise multi-channel pressure control
• Valve terminal VTUX with multi-channel vacuum switch control and various communication protocols to maximize integrated control, data feedback, and digital functions
• Proven successful cases with the ability to co-develop customized solutions with customers
• Providing chuck design concepts and recommendations to speed up customer design timelines and shorten validation time
  

Advanced packaging process solution for dispensing adhesive and laminating heat sinks

Application area:

The runner is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.

Highlights of application:

• 1 valve terminal VTEP controls all system required pressure (if possible). We can also use VEAB with maniple
• Pick and place to control vacuum with accuracy and also detect the failure of the suction cup
• Glue to show high accuracy of air pressure supply for glue
• Pressing to show high accuracy of pressing force
• With support of AX, it can easily monitor cylinder health rate
  
  
  

Wafer Handling

Application area:

Wafer handling and transfer within semiconductor front-end equipment, particularly in EFEM (Equipment Front End Module) systems.

The solution covers wafer loading from FOUPs, atmospheric and vacuum process modules, coating or drying simulations, and precise wafer positioning during transport and processing.

Highlights of application:

• Inverted gantry concept as a cost-efficient SCARA robot alternative
• Integrated wafer aligner for fast, reliable and safe substrate handling
• Gentle control of slit and gate valves for vacuum processes
• Pneumatic lift system for secure wafer transfer and positioning
• Micrometer-level micro-positioning for high-precision applications
• Compact, modular design for seamless EFEM integration