High-vacuum processes are the basis for many critical steps in chip and semiconductor production. In highly sensitive environments, where even the smallest particles can disrupt processes or damage components, maximum precision, purity and repeat accuracy are essential. Festo offers automation solutions that are precisely tailored to these requirements and use leading technologies that are reliable and compatible with cleanroom requirements.
Typical high-vacuum applications include processes such as deposition, etching or ion implantation. They are often carried out in pressure ranges between 10-⁶ and 10-⁸ mbar and place extremely stringent demands on material resistance, temperature control, speed and repeat accuracy for controlling the process gases. Using innovative components and system solutions, Festo supports its customers in ensuring process quality, minimising downtimes and achieving maximum yields. Whether you need temperature-stable gas valves, low-particle wafer handling or energy-efficient drives, we supply solutions that can be seamlessly integrated into existing systems and at the same time offer space for technological development.
When flooding FOUPs for 300 mm wafers with nitrogen, the transport containers need to be flushed to prevent oxidation and particle contamination. A laminar flow rate is generated in the EFEMs that rinses particles downwards within the module, ensuring that there are no particles on the wafer.
Our products: highly efficient valves with piezo technology such as VEAD, VEFC, VEMD.
The lock between atmospheric and high-vacuum areas, the so-called load-lock, is when a wafer is inserted at atmospheric pressure, evacuated and then placed in the transfer chamber. This is also how processed wafers are returned to the EFEM. To do this, the load-lock is gently pressurised again. Festo valves precisely control the regeneration process along predefined pressure curves. This prevents turbulence, heat stresses and reduces mechanical loads.
Recommended products: flow control valve VEAD, mass flow controller VEFC
Festo relies on an "inverted gantry" for handling wafers between the FOUP and the load-lock. This Cartesian robot ensures that the wafers are moved safely and quickly in an atmospheric environment. The solution saves space and is perfect for integration into existing EFEMs.
Recommended products: electric axis ELGD
Each process chamber has one or more gas boxes. This is the part of the system in which the required process gases are controlled, or gas mixtures are produced using high-purity stainless steel valves.
Festo offers special valves for this application that meet the requirements for installation space, service life and reproducibility of switching speeds.
The demands on gas valves in atomic layer deposition (ALD) systems are extremely high. Processes such as introducing the process gases and rinsing with inert gases, always have an identical sequence that is carried out within a few milliseconds and with maximum repeat accuracy. The high temperatures of the gaseous media subject the valve technology to a high load. The ideal solution for a repeatable and stable ALD process is the special fast-switching valve MH2 for pilot control of the media valves for ambient temperatures up to 120 °C.
Recommended products: fast-switching valve MH2
The wafer pin lift in a high vacuum enables the wafer to be positioned in the process chamber with very little vibration, using either a single drive or 3 synchronised drives. The substrate can also be moved and positioned without vibrations and with a precision of up to one micrometre. The pneumatic solutions operate virtually without vibration, preventing so-called wafer walk. The advantage of the solution from Festo is that the system identifies the force required to lift the wafer from the ESC. This significantly reduces the risk of microcracks in the wafer or even complete wafer breakage. The pneumatic solution is more compact than electric systems and reduces the number of electric components such as motors close to the chamber, while the required valve terminal and its controls can be positioned further away from the process chamber.
Recommended products: valve terminal VTEP, controller CPX-E, sensor SDAT
The solution significantly reduces vibrations when opening and closing gate valves, also known as transfer or slit valves. The system allows for smooth starting and braking without affecting the cycle time. Angle valves can be efficiently controlled in the same way.
The pedestal lift is used in particular in coating systems. The system ensures that the substrate or wafer in the process chamber is correctly positioned in relation to the plasma and showerhead.
In addition to electric solutions, we also offer pneumatic drives to carry out this alignment. The advantage of pneumatic solutions is that they generally have a smaller footprint and have fewer components that generate heat such as motors or motor controllers.
Having the exact right temperature is crucial in many semiconductor manufacturing processes. On the one hand, the electrostatic wafer chuck (ESC) must be heated with pinpoint accuracy in order to bring the wafers to the required temperature for safe and stable processes. On the other hand, system components such as the plasma generator or process chamber need to be cooled so they can operate reliably over the long term. Valve VZXA reliably regulates cooling and heating media between -80 °C and +100 °C. The valves can be used flexibly as individual valves or in customised valve blocks.
Recommended products: angle seat valve VZXA
Every process chamber, as well as the load-lock and the transfer chamber, has a cover that can be opened if required. It must be possible to open and close the cover safely for maintenance or servicing. Festo offers both electric and pneumatic solutions that can be flexibly integrated into existing systems. Safety functions can be added if necessary.
Master the challenges of your semiconductor production processes with our customised automation solutions for vacuum applications. This allows you to sustainably stabilise your current processes while increasing quality and cycle times and maximising yield.
Our technologies provide you with quality that you can rely on and that will give you a competitive edge:
In our blog article "Reducing nitrogen consumption thanks to valves with piezo technology", you can find out how you can reduce nitrogen consumption by up to 75% when rinsing FOUPs with VEFC and VEAD. These valves have been specially developed for dosing inert gases and offer advantages such as high dynamic response, low particle generation and long service life.
In semiconductor production, high-vacuum processes and wafer front-end equipment (WFE) such as deposition, ion implantation or dry etching place extremely high demands on purity, outgassing and reliability. That is why we offer specially developed automation solutions including vacuum-compatible drives, valves and handling systems that work safely and precisely even under extreme conditions such as high temperatures or aggressive media. Our components have low-particle operation and can be flexibly integrated even in tight installation spaces. Our many years of experience in the semiconductor industry enable us to support you in designing efficient, reproducible and fail-safe processes.
When handling process gases in high vacuum processes safety is absolutely crucial. The gases used are often either corrosive or reactive and always harmful to health. As a rule, the gases should be introduced precisely and with the best possible repeat accuracy to ensure the relevant process step is successful. This applies regardless of whether it is a carrier gas, a cleaning gas or the actual process gas for an etching process or a highly dynamic ALD (atomic layer deposition) process. Festo offers you the right solution for the cost-effective control of your pneumatic UHP valves, such as classic gas sticks or ALD valves for high-temperature applications. We have the right valve technology for every application.
By cleverly controlling slit valves, gate valves and transfer valves, the vibration in the tool can be considerably reduced while particle generation and stuttering are also minimised. This protects the valve seal as well. In addition to slit and transfer valves, angle valves can also be controlled pneumatically. Another important application is the regeneration of vacuum chambers, such as load-locks. Economical mass flow controllers (MFC) from Festo for reliably and gently regenerating inert gases.
We offer specialised solutions for handling substrates, be they 300 mm silicon wafers, 150/200 mm SiC wafers or panels in advanced packaging. Our pneumatic pin lift for high-vacuum chambers is a key application. This allows wafers to be gently moved end-to-end or positioned in the process at the micrometre level – with controlled force, minimal energy input and without additional motor controllers near the chamber. Other solutions include pedestal lifts and compact wafer end effectors with integrated aligners for precise positioning in confined spaces.
Precisely controlling the temperature of process gases, substrates and process components is crucial for the quality of coating and etching processes. Rising temperatures pose increasing challenges for semiconductor manufacturers. We offer intelligent temperature control solutions that can be used to safely and efficiently cool or control the temperature of wafer chucks (electrostatic chucks / ESC), process chambers, plasma sources or RF generators, among others. With our systems the temperature can be reliably controlled, resulting in stable processes, higher yields and longer service lives for your systems.