For these environments, we offer innovative solutions for precisely controlling media, gently handling wafers and precisely regulating forces, pressures and motion profiles. The focus here is on minimised particle generation, high process stability and efficient integration. You can automate and scale your processes safely and efficiently with Festo, whether for raw substrates, reticles/SMIFs, FOUPs, completely processed wafers in advanced packaging applications such as flip chip and hybrid bonding or die banks.
Applications in atmospheric environments
Wafer handling: space-saving transfer
Festo relies on an "inverted gantry" for handling wafers between the FOUP and the load lock. This Cartesian robot ensures the wafers are moved quickly and reliably in an atmospheric environment. The solution is space-saving and can also be integrated into existing EFEMs.
Recommended products:
Electric axis ELGD
Wafer aligner: several steps in one
Our globally unique wafer aligner combines end effector and aligner in one compact system. Its gentle handling, optimum reproducibility and a very small footprint are really impressive. Our automation solution positions the wafer directly on the holder, detects markings such as notches, aligns the wafer accordingly and loads it into the process chamber with pinpoint accuracy. By combining several steps in one module cycle times are reduced, the EFEM requires significantly less space and the number of wafer picks, i.e. how often the wafer is picked up and put down, is decreased. Contactless alignment is achieved using the Bernoulli effect. This means that the wafer can also be turned ("flipped") and inserted upside down into the process.
Smart wafer pin lift control: precision with force detection
With the pin lift, the wafers can be positioned without vibrations and with an accuracy of down to one micrometre. The substrate can also be moved without vibrations in order to avoid so-called wafer walk. A major advantage is that the system detects the force required to lift the wafer, e.g. from an electro-static wafer chuck (ESC). This significantly reduces the risk of microcracks in the wafer or even complete wafer breakage. A pneumatic solution is more compact than an electric system, as it reduces electric components such as motors and motor controllers and therefore also heat emission, since the control valves do not have to be positioned directly next to the process chamber. Specialised drives for high vacuum areas can also be actuated using Festo control valves.
The system generates and supplies data that you can use to monitor the status of the system. To do this, you can use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as a complete, tailored system.
Recommended products:
Valve terminal VTEP
Controller CPX-E
Sensor SDAT
N2 purge with MFC: purity with minimised footprint
Our N2 purge solutions for creating and maintaining clean atmospheres reliably prevent oxidation by atmospheric oxygen and contamination by airborne particles. You will find the right system for every application, from low to high flow rate performance, for instance for FOUPs. Our portfolio includes mass flow controllers (MFC) as single-channel and valve terminals with several MFCs as a multi-channel solution. For EFEMs, SMIF/FOUP stockers or die banks, we offer purge solutions with a particularly compact footprint. The system generates data that you can use to monitor the condition of the system, especially the degree of pollution of the filters used. Avoid unplanned machine downtime and optimise your process.
Recommended products:
Our mass flow controllers VEMD, VEAD, VEFC, VTEP
Photoresist (PR) coating with suck-back control
When coating substrates with photoresists (PR), which can be costly, our dosing valves ensure the layers have the right thicknesses. This also guarantees stable and reproducible process quality and optimum economic efficiency. The suck-back function prevents droplets from getting stuck on the outside of the nozzle tip. Our valves ensure precise PR dispensing and retraction of the last drop, protecting the sensitive media from atmospheric oxygen.
Recommended products:
Dosing valves VEAB and VTEP
Media-separated solenoid valves VYKA/ VYKC
Electric drives EPCO and ERMO and suitable sensors
Controlling process media with reliable valve and sensor systems
Our valves and sensors control the process media in the sub-fab, hook-up and WFE/tool with maximum precision and efficiency. Regardless of whether the application involves slurry with abrasive particles, wet chemistry such as acids or alkalis, DI water or solvents, regardless of whether the installation is in a dry box, a control cabinet or directly on the tool, and regardless of whether your focus is on a minimised footprint, particle purity, fast switching times or special environmental requirements such as high temperature or chemical loads: Festo offers reliable valve and control solutions for every application, even for long-lasting and reliable semiconductor production.
Our systems can generate data that you can use to monitor the condition of the system. To do this, you can use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as a complete, tailored system.
Recommended products:
Valves VTOC, MH1, MHA2 and VUVG/ VTUX
Sensors SPTE, SPAN and SPAF
Bowl lift: pneumatic micro-positioning
The so-called bowl lift uses pneumatics drives with which liquid process media can be separated, reused or carefully disposed of. The collection containers (bowls or dishes) are precisely positioned and held securely depending on the medium or required spraying height. At the same time, the system helps to significantly reduce vibrations and shocks during system operation.
Our systems can generate data that you can use to monitor the condition of the system. To do this, you can use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as a complete, tailored system.
Recommended products:
Valve terminal VTEP
Cylinder DFM
Controller CPX-E
Sensor SDAT
Precise pressure control and force regulation for polishing applications
In chemical mechanical polishing (CMP), our pneumatic control components ensure a dynamic and highly precise pressing force between the wafer and lapping table. The piezo valves regulate the pressure in real time so the wafers can be very lifted and pressed very gently. The valves, together with our pressure sensors, guarantee maximum precision.
Recommended products:
Piezo valves VTEP and VEAB
Pressure sensor SPAN
Media-separated solenoid valve VYKC
Door shutter: proportional motion control
In wet process systems such as spin cleaners or coater lines, it is important that the door to the process chamber is reliable. This is especially important in the cleanroom where it must reliably protect the wafers from contamination even under unexpected conditions – such as failure of the power or air supply – and must not be a source of particles itself. Our door shutter solutions include precise and reliable round cylinders with special lubricants for automated opening and closing. Our pneumatic interlock systems also facilitate secure locking. The sensors used provide reliable feedback on the position.
Recommended products:
Round cylinder DSNU
Interlock systems VOFA, VTOC, MH1, VUVG/ VTUG, VTUX
Sensors SPTE, SPAN and SPAF
Your success is our goal: we support you with smart automation for your atmospheric processes
Take advantage of our expertise in the production of semiconductors, whether it involves power electronics, MEMS, logic or memory chips and whether the wafers are made of silicon, sapphire or SiC (silicon carbide). We would be happy to advise you on your specific application, be it FOUP handling, PR dispensing or CMP. We can develop solutions together that perfectly match your requirements and your system architecture.
We understand the challenges our customers face and support you with solutions that boost your long-term success:
- Optimised front-end: increase EFEM performance with our inverted gantry system. This handling system is very compact, durable and a cost-effective alternative to conventional Scara robots.
- Resistant valves: talk to us about precisely and gently controlling pneumatic high-purity valves made of PTFE and PFA.
- No dripping: our valves with suck-back function prevent dripping, ensuring precise PR dispensing.
- Precisely removing material: with our innovative precision valves, you can accurately control the contact pressurefor fast and meticulous material removal.
Fast product selection with the right engineering tool
Reduce nitrogen and energy consumption
You can master the challenges brought on by price pressures in the semiconductor industry. A long-term reduction in nitrogen and energy consumption also improves your carbon footprint in the production of semiconductors.
FAQs
What solutions do we offer for atmospheric processes such as PR coating, wet cleaning and CMP?
We support atmospheric processes in semiconductor manufacturing such as PR coating, exposure, development, wet processes and CMP with precise automation solutions, for example with inverted gantry systems for substrate or reticle/mask handling, valve technology for precise and reliable control and regulation of media valves such as high-purity valves made of polymer or UHP valves made of stainless steel as well as compact pneumatic and electric drives. You will find our solutions in the actual process tool, but also in peripheral equipment such as cleaning and handling systems for FOUPs, SMIFs or reticles/masks as well as storage technology and solutions for modern packaging steps such as flip chip or hybrid bonding in advanced packaging.
Does Festo offer special solutions for FOUP or SMIF pods or substrate or reticle handling?
We offer numerous specialised solutions for handling FOUPs, SMIF pods, substrates and reticles in highly automated semiconductor factories. Our inverted gantry system saves space and moves efficiently in the EFEM, while our innovative wafer aligner accelerates the loading process and shortens cycle times thanks to integrated alignment. For FOUPs, we supply high-performance N2 purge systems with precise control. They are available as single or multi-channel solutions, which helps you to reduce the number of I/Os or operate several MFCs with one bus module. We also develop compact purge systems for SMIF/FOUP stockers or die banks that precisely control even low flow rates and ensure a pure, protected atmosphere.
Does Festo have special solutions for wet processes, such as PR coating, development and strip or spin cleaning?
We offer special solutions for wet processes such as PR coating, development, strip or spin cleaning. Our solutions, such as valves and sensors, control your high-purity valves made of PFA, PTFE, PVDV or PP, or your ultra-high-purity valves made of stainless steel extremely precisely and efficiently. They also have a long service life as they are actuated very gently. Our systems can generate data that you can use to monitor the condition of the system. To do this, you can use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as a complete, tailored system.
You can be sure to find the right installation for every application, whether you are using a dry box, a control cabinet or installation directly on the tool, or whether your focus is on a minimised footprint, particle purity, fast switching times, special environmental requirements such as high temperatures or chemical loads. Dispensing aggressive chemicals using valves with a suck-back function prevents dripping during PR dispensing and ensures media volumes are accurate. For spin-cleaning processes, we supply pneumatic drives that control the bowl lift and continuously adjust the splash guard or media separator to the required position. That is how we support safe, efficient and contamination-free process management. And this is how we make a small contribution to sustainable production processes. By using innovative valve technology from Festo, you can save energy and reduce your CO2 footprint at the same time. We will be happy to support you on your journey to becoming a "green fab".
Does Festo offer special solutions for CMP processes or machines?
We offer special solutions for CMP processes where maximum precision and dynamics are required, especially in advanced packaging. The contact pressure is accurately regulated by our high-precision piezo valves, which is crucial for controlled and even material removal. This is howwe support process quality and minimise rejects, and also help you to shorten process times. In addition, we develop solutions that improve the efficiency and availability of CMP systems, for example in combination with conditioner pads or intelligent automation components.
What does Festo offer for general semiconductor fab automation?
We offer comprehensive solutions for the automation of all areas and process steps in semicon fabs. Through the research we carry out and our pioneering products, we support technological advances for innovative systems. In the SubFab, we ensure reliable media supply and stable processes such as the treatment of waste water or waste gases, among other things. Our automation solutions, ranging from precise valves and intelligent drives to complete handling systems, reliably help make production processes more stable, faster and more energy-efficient.
Leverage the data that our solutions generate and monitor the machine status or optimise your process by using the FestoAI solutions "Festo AX" , either as a single module for a specific application or as a personalised overall solution for your system.
Reduce power consumption in your system and throughout the fab by using innovative Festo technology. Make double the savings with us! Reduce the power consumption of your system and optimise the consumption of compressed air/CDA and inert gases. We support you on your mission to reduce the CO2 footprint.
Does Festo offer solutions for advanced packaging?
We offer innovative solutions for advanced packaging, which plays a central role in modern chiplets such as HBM. For processes such as flip chip or fusion/hybrid bonding, we supply precise handling actuators to prevent "squeeze-outs" in adhesive bonding. Benefit from precise actuators that help you to achieve precise movements with an accuracy of 1 µm.
Measure the bending of wafers (warped wafers) and pull them onto your chuck.
Monitor the processes and machine status with Festo AX. Make the most of innovative Festo technology in your fusion/hybrid bonder and increase process reliability and quality in demanding advanced packaging.