Create "Core" Values for Semiconductor

Semiconductor back-end process equipment: dispensing glue and heat sink laminating machine/laminating machine

Application area:

The runner is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.

Highlights of application:

• 1 valve terminal VTEP controls all system required pressure (if possible). We can also use VEAB with maniple
• Pick and place to control vacuum with accuracy and also detect the failure of the suction cup
• Glue to show high accuracy of air pressure supply for glue.
• Pressing to show high accuracy of pressing force
• With support of AX, it can easily monitor cylinder health rate

Semiconductor front-end process equipment solutions

Application area:

Temperature control devices such as platform cooling used in sputtering and etching processes require high-precision temperature stability.

Highlights of application:

• Chiller Block capability to -60 degree with special angle valve
• Interlock valve system to prevent gas mix
• Digital information and physical information separate from system
• High accuracy control for iso Valve through valve VEAB

Gate valve control solution

Application area:
load-lock chamber / handling system / process chamber

Highlights of application:

• Significantly reduce the impact force generated when the door valve is switched
• The application program achieves the control of multiple valves in a single component
• High repeatability through digital parameter set
• Easy to trace - ideal for Industrial IoT

Customized solution:
In the semiconductor industry EFEM wafer transfer equipment, the application solution of the motion terminal system filling the FOUP carrier with inert gas can effectively reduce the pollution particles generated when the valve is switched.

N2 Purge system

Application area:
Application solution for advanced semiconductor wafer manufacturing processes that require micro-pollution prevention (AMC Free) in various wafer transportation and storage occasions such as STOCKER, FOUP, OHT, and STB.

Highlights of application:

• Piezo valve design for precise flow control up to 200 liters per minute
• Simplify engineering design, commissioning and operation, integrated module design, ready-to-install solution
• Multi units of MFC can be integrated into a motion terminal for setup

Customized solution:
Festo pneumatic control application solutions can reduce wafer oxidation and maintain a dry state to stabilize the FOUP internal environment. In the N2 Purge system, various sensors and flow controllers are used to cooperate, and the precise proportional control of the piezoelectric valve is used to achieve accurate flow control, and data collection and transmission are realized through communication.

In addition, using the digital pneumatic technology of Festo motion terminal, not only precisely controlling the pressure/flow rate of the air knife during blowing, but also the integrated smart sensor can be used for control, diagnosis and self-learning tasks, so that the parameter combination can be optimally matched.

Special gas supply and chemical polishing gas control unit

Application area:

Semiconductor (both special gas supply and chemical polishing gas control units are used in the semiconductor front-end processes)

Highlights of application:

Without the need for a power source, the gas supply to the gas cylinder can still be cut off; Adopting special OR valve design to ensure uninterrupted system control; Hot swappable function allows for the replacement of solenoid valves without the need to turn off the air supply.

Customized sulution:

• Customized manual safety circuit with multi-channel control using manual valves and logic valves, while also having a more compact design.
• The specially designed manual energy storage gas cylinder switch system not only retains manual operation mode, but also can automatically shut off gas cylinders without any power source.
• A simple customized cylinder driven red indicator saves space while ensuring operational safety.

Leak Test application scheme

Application area:

Various gases will be used in the production process of semiconductor plants.

Highlights of application:

Festo's various sensors and customized solutions can provide leakage detection solutions in the form of flow or differential pressure. Conduct real-time monitoring to ensure the reliability of production process and quality, and also help the factory to save costs.