In today's world, where the wave of the digital economy is sweeping across the globe, digitalization has become the core engine for enterprises to break through and move forward. In this wave, Festo, a global automation company with a century of technological expertise, is committed to working hand in hand with customers to turn the visions and ideas of digital industry and intelligent manufacturing into real applications. The 2025 South China International Industrial Expo will be held from June 4 to June 6 at the Shenzhen Convention and Exhibition Center. At that time, Festo will showcase under the theme "Injecting New Momentum into the World with Automation," presenting a range of innovative digital and electrification products and solutions. We sincerely invite you to visit the Festo booth and discuss the future of "integrating pneumatics and electrics, balancing software and hardware" and sustainable development with our technical experts.
Festo Booth: Hall 12, Booth A120
Application: Advanced packaging process
Highlights：
The IC chips on tray are transported to the glue coating area for coating. The coated IC chips are then transported to the hot-pressing station through the conveyer for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the IC chips, greatly enhancing the overall reliability and productivity of the advanced packaging process. With support of Festo AX, it can easily monitor cylinder health rate, providing intelligent production for the semiconductor industry.
Core technology: