In the wave of technological advancements, semiconductors, as the core driving force, are reshaping the world at an unprecedented pace. In the face of various challenges faced by the semiconductor manufacturing industry, Festo, a global automation company with a century-long history, has always adhered to a dual-wheel drive of technological innovation and exceptional quality, injecting new momentum into the development of the semiconductor industry. SEMICON China, the world's largest semiconductor exhibition, will grandly open at the Shanghai New International Expo Centre from March 26th to 28th. This time, with the theme of "Innovating Together for Chip Success, Intelligently Manufacturing Value," Festo will showcase a series of advanced automation solutions and innovative industrial applications, helping semiconductor manufacturing enterprises to forcefully break through in the "chip" wave. We sincerely invite you to visit our booth at the exhibition to engage in face-to-face exchanges with us and jointly explore the limitless possibilities of semiconductor development.
Date: March 26th - 28th
Venue: Shanghai New International Expo Centre
Address: No. 2345 Longyang Road, Pudong New Area, Shanghai
Festo Booth: Booth 6519, Hall E6
Application: Advanced packaging process
Highlights:
The IC chips on tray are transported to the glue coating area for coating. The coated IC chips are then transported to the hot-pressing station through the conveyer for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the IC chips, greatly enhancing the overall reliability and productivity of the advanced packaging process. With support of Festo AX, it can easily monitor cylinder health rate, providing intelligent production for the semiconductor industry.
Core technology:
Application: Wafer wet cleaning station
Highlights: In the wafer wet cleaning station, the piezo valve VTEP accurately controls the synchronized movement of multiple low-friction cylinders to achieve continuously adjustable speed and position during the lifting up and down of the large-size wafer cup, preventing the cleaning solution from splashing out or remaining and avoiding cross-contamination. The precision and stability of the cup control directly affects the cleaning effect.
Core Products:
Application:Semiconductor Front-end Facility process (Gas cabinet application)
Highlights:
Core Products:
Chiller Block
Application:Semiconductor lithography, etching, thin film deposition
Highlights:
Dedicated cooling system components that accurately control the temperature of the equipment maintain the equipment at a constant low temperature or within a specific temperature range to ensure process stability and chip yields.
Application:
Load-lock chambers / handling systems / process chambers for production lines in the semiconductor and photovoltaic industries.
Highlights:
Core Products:
Application:
Suitable for advanced processes of semiconductor wafers requiring micro-contamination control, such as EFFEM, STOCKER, FOUP, OHT, and STB for various wafer handling and storage applications.
Highlights:
Core products:
Application:
Bellows cylinders for controlling Lift Pins in semiconductor equipment.
Highlights:
Core products: