In the wave of technological advancements, semiconductors, as the core driving force, are reshaping the world at an unprecedented pace. In the face of various challenges faced by the semiconductor manufacturing industry, Festo, a global automation company with a century-long history, has always adhered to a dual-wheel drive of technological innovation and exceptional quality, injecting new momentum into the development of the semiconductor industry. SEMICON Taiwan will grandly open at Taipei Tai NEX 1&2 from September 10th to 12th. This time, with the theme of "Innovating Together for Chip Success, Intelligently Manufacturing Value," Festo will showcase a series of advanced automation solutions and innovative industrial applications, helping semiconductor manufacturing enterprises to forcefully break through in the "chip" wave. We sincerely invite you to visit our booth at the exhibition to engage in face-to-face exchanges with us and jointly explore the limitless possibilities of semiconductor development.
Festo Booth: Hall 1, 1F, Stand J3146
As semiconductor processes advance, wafer and substrate warpage often occurs in metrology, wafer bonding, and advanced packaging. Although contact (pressing) solutions exist, they face limits in space and process needs. Festo offers a new non-contact solution.
This solution combines Festo digital and piezo technologies for precise pressure control. We also work closely with customers to develop complete solutions, tackling warpage challenges together.
The runner is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.
Temperature control devices such as platform cooling used in sputtering and etching processes require high-precision temperature stability.
Application area:
load-lock chamber / handling system / process chamber
Highlights of application:
Customized solution:
In the semiconductor industry EFEM wafer transfer equipment, the motion terminal system and the precise piezo control technology applied to FOUP carriers for inert gas filling offer an effective solution to reduce the impact force of slit/gate valves when closing. This minimizes particle generation and vibration, significantly improving yield and extending the lifespan of valves.
Semiconductor (both special gas supply and chemical polishing gas control units are used in the semiconductor front-end processes)
Without the need for a power source, the gas supply to the gas cylinder can still be cut off; Adopting special OR valve design to ensure uninterrupted system control; Hot swappable function allows for the replacement of solenoid valves without the need to turn off the air supply.
Application area:
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker
Highlights of application:
In the N2 Purge system, Festo various sensors and flow controllers cooperate to achieve system integration design, and accurate flow control is achieved through accurate proportional control of piezoelectric valve, and data is achieved through communication.
Customized solution: