In the wave of technological advancements, semiconductors, as the core driving force, are reshaping the world at an unprecedented pace. In the face of various challenges faced by the semiconductor manufacturing industry, Festo, a global automation company with a century-long history, has always adhered to a dual-wheel drive of technological innovation and exceptional quality, injecting new momentum into the development of the semiconductor industry. SEMICON Taiwan will grandly open at Taipei Tai NEX 1&2 from September 10th to 12th. This time, with the theme of "Innovating Together for Chip Success, Intelligently Manufacturing Value," Festo will showcase a series of advanced automation solutions and innovative industrial applications, helping semiconductor manufacturing enterprises to forcefully break through in the "chip" wave. We sincerely invite you to visit our booth at the exhibition to engage in face-to-face exchanges with us and jointly explore the limitless possibilities of semiconductor development.
Festo Booth: Hall 1, 1F, Stand J3146
As semiconductor processes advance, wafer and substrate warpage often occurs in metrology, wafer bonding, and advanced packaging. Although contact (pressing) solutions exist, they face limits in space and process needs. Festo offers a new non-contact solution.
This solution combines Festo digital and piezo technologies for precise pressure control. We also work closely with customers to develop complete solutions, tackling warpage challenges together.
The runner is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.