Exhibition Information

Date: March 25–27, 2026

Venue: Shanghai New International Expo Centre (No. 2345 Longyang Road, Pudong)

Festo Booth: Hall E7, Booth 7255

Visit the Festo booth to see how “Precision Control” is put into practice and to witness new momentum being injected into the development of the semiconductor industry.

Highlighted Festo Solutions

Liquid Suction-Back Control Solutions

• Precise pressure control using Festo piezoelectric technology
• Intelligent, adjustable suction-back control for true zero dripping and zero contamination
• Digitalized
• Long service life with low maintenance costs
• Modular integration

"Non-contact" Wafer Warpage Solution

• Flexibly adapts to different wafer warpage scenarios to improve yield
• Festo piezoelectric technology enables multi-loop precise pressure control
• Standardized, cost-effective solution
• Festo patented technology

Transfer Valve Gate Switching Control Solution

• Significantly reduces impact forces during gate switching for smoother operation
• Substantially extends seal life, reducing equipment downtime
• Cycle time maintained or improved, boosting overall throughput
• Fast integration with Festo’s controlled pneumatic algorithms and standardized hardware

Micro Positioning Control System

• Ensures precise positioning and equipment stability while increasing motion speed
• Supports a variety of standard pneumatic actuators to flexibly meet different process requirements
• Integrated intelligent pneumatic control delivering a complete closed-loop positioning solution from hardware to algorithms