Festo Booth: P5324
Designed for wet process equipment in the semiconductor and optoelectronics industries, including wet benches, wafer cleaning systems, and spin-coating cups. Typical control applications include:
These applications often face challenges such as poor motion synchronization, unstable control, limited digitalization, and a lack of real-time visibility into equipment status and actual position. By combining pneumatic and electric technologies, Festo provides a complete and highly integrated control solution.
For semiconductor wet process equipment, the all-stainless-steel servo drive system — featuring the EPRF electric cylinder and EMMH servo motor — works together with the high-precision VTEP piezoelectric proportional valve and VYKC media-separated valve.
This integrated solution delivers precise control and enhanced protection for cup lifting and chemical fluid handling. It helps prevent chemical corrosion, dripping, and process defects, contributing to higher wafer yield and longer equipment service life.
As semiconductor processes continue to advance, wafer and panel/substrate warpage is becoming increasingly common in applications such as metrology, wafer bonding, and advanced packaging.
Although contact-based flattening solutions are already available, challenges remain due to limited installation space, varying process requirements, and increasingly complex warpage profiles.
By combining digital control with piezoelectric proportional technology, Festo enables high-precision, zoned positive and negative pressure control. With proven co-development expertise, Festo can also deliver complete, customized solutions for a wide range of warpage control requirements.
The runner is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.
Temperature control devices such as platform cooling used in sputtering and etching processes require high-precision temperature stability.
Application area:
load-lock chamber / handling system / process chamber
Highlights of application:
Customized solution:
In the semiconductor industry EFEM wafer transfer equipment, the motion terminal system and the precise piezo control technology applied to FOUP carriers for inert gas filling offer an effective solution to reduce the impact force of slit/gate valves when closing. This minimizes particle generation and vibration, significantly improving yield and extending the lifespan of valves.
Semiconductor (both special gas supply and chemical polishing gas control units are used in the semiconductor front-end processes)
Without the need for a power source, the gas supply to the gas cylinder can still be cut off; Adopting special OR valve design to ensure uninterrupted system control; Hot swappable function allows for the replacement of solenoid valves without the need to turn off the air supply.
Application area:
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker
Highlights of application:
In the N2 Purge system, Festo various sensors and flow controllers cooperate to achieve system integration design, and accurate flow control is achieved through accurate proportional control of piezoelectric valve, and data is achieved through communication.
Customized solution: