SEMICON Taiwan 2026 | Event Information

• Date: September 2–4
• Venue: 1F, TaiNEX 2
• Address: No. 2, Jingmao 2nd Road, Nangang District, Taipei

Festo Booth: P5324

Highlights of Exhibition

Integrated pneumatic and electric solution for Semiconductor Wet Processes

Application area:

Designed for wet process equipment in the semiconductor and optoelectronics industries, including single wafer, wafer cleaning systems, and spin-coating cups. Typical control applications include:

• Cup lifting control
• Dispensing arm lifting and rotary control
• Chemical dispensing valve switching and suck-back control
• Corrosion-resistant components

These applications often face challenges such as poor motion synchronization, unstable control, limited digitalization, and a lack of real-time visibility into equipment status and actual position. By combining pneumatic and electric technologies, Festo provides a complete and highly integrated control solution.

Highlights of application:

• Offers both pneumatic and electric solutions for the same application, supporting different machine design requirements
• Uses high-precision piezoelectric control technology to digitalize chemical valve switching and suck-back control, improving process stability and consistency
• Electric and pneumatic cylinders support position feedback, enhancing digital equipment management and reducing run-to-die risks
• Multi-axis cylinder synchronization with speed and force control reduces interference during cup lifting, minimizes manual adjustments, and improves process stability
• Integrated magnetic encoder with secondary feedback enhances equipment digitalization and monitoring capabilities

Customized sulution:

For semiconductor wet process equipment, the all-stainless-steel servo drive system — featuring the EPRF electric cylinder and EMMH servo motor — works together with the high-precision VTEP piezoelectric proportional valve and VYKC media-separated valve.

This integrated solution delivers precise control and enhanced protection for cup lifting and chemical fluid handling. It helps prevent chemical corrosion, dripping, and process defects, contributing to higher wafer yield and longer equipment service life.

Wafer & Panel warpage solution

Application area:

Enables effective gripping and flattening of wafers and substrates with different warpage profiles, including bow, umbrella, and saddle shapes. A zoned chuck design enables step-by-step control to gradually flatten highly warped wafers and substrates.

Highlights of application:

• The VTEP proportional pressure and vacuum valve terminal, combined with patented Festo control technology, enables precise multi-channel pressure control
• VTUX multi-channel vacuum switching supports multiple communication protocols, maximizing system integration, data feedback, and digital functionality
• Proven application experience and co-development capabilities support customized solutions tailored to specific customer requirements
• Multi-zone Chuck design concepts and technical recommendations help accelerate development and shorten validation time

Advanced packaging process solution for dispensing adhesive and laminating heat sinks

Application area:

The wafer is transported to the glue coating area for coating. The coated product is then transported to the hot pressing station through the runner for heat curing, pressing and bonding of the product and glue. Closed loop force control is used. The module can accurately control the pressing force and protect the product.

Highlights of application:

• 1 valve terminal VTEP controls all system required pressure (if possible). We can also use VEAB with maniple
• Pick and place to control vacuum with accuracy and also detect the failure of the suction cup
• Glue to show high accuracy of air pressure supply for glue.
• Pressing to show high accuracy of pressing force
• With support of AX, it can easily monitor cylinder health rate

Semiconductor front-end process equipment solutions

Application area:

Temperature control devices such as platform cooling used in sputtering and etching processes require high-precision temperature stability.

Highlights of application:

• Chiller Block capability to -60 degree with special angle valve
• Interlock valve system to prevent gas mix
• Digital information and physical information separate from system
• Piezoelectric control technology enables precise wafer lifting and Soft Landing
• High-precision ISO valve control with piezo valve reduces particle generation and extends valve service life

Gate valve advanced motion control solution

Application area:
load-lock chamber / handling system / process chamber

Highlights of application:

• Reduces impact, particle generation, and vibration during gate valve operation
• Extends gate valve and O-ring service life while improving process yield

Special gas supply and chemical polishing gas control unit

Application area:

Semiconductor (both special gas supply and chemical polishing gas control units are used in the semiconductor front-end processes)

Highlights of application:

Without the need for a power source, the gas supply to the gas cylinder can still be cut off; Adopting special OR valve design to ensure uninterrupted system control; Hot swappable function allows for the replacement of solenoid valves without the need to turn off the air supply.

Customized sulution:

• Customized manual safety circuit with multi-channel control using manual valves and logic valves, while also having a more compact design.
• The specially designed manual energy storage gas cylinder switch system not only retains manual operation mode, but also can automatically shut off gas cylinders without any power source.
• A simple customized cylinder driven red indicator saves space while ensuring operational safety.

MFC (Mass Flow Controller)

Application area:
Load Port / Slide Track Buffer / OHC Purge System / FOUP Stocker

Highlights of application:
In the N2 Purge system, Festo various sensors and flow controllers cooperate to achieve system integration design, and accurate flow control is achieved through accurate proportional control of piezoelectric valve, and data is achieved through communication.

Customized solution:

• Piezo valve design for precise flow control, offering multiple flow ranges: 200 / 100 / 50 / 20 LPM
• Integrated modular design combines vacuum humidity detection with precise flow control
• RS485 communication and analog signal