High-vacuum processes are the foundation of many critical steps in chip and semiconductor production. In highly sensitive environments, where even the smallest particles can disrupt processes or damage components, maximum precision, purity, and repeatability are essential. Festo offers automation solutions that are precisely tailored to these requirements – technologically leading, reliable, and consistently cleanroom-compatible.
Typical high-vacuum applications include processes such as deposition, etching, or ion implantation. They often take place in pressure ranges between 10-⁶ and 10-⁸ mbar and place the highest demands on material resistance, temperature control, speed, and repeat accuracy of the process gas control. With innovative components and system solutions, Festo supports its customers in ensuring their process quality, minimizing downtimes, and achieving maximum yields. Whether it's temperature-stable gas valves, low-particle wafer handling, or energy-efficient drives – we supply solutions that can be seamlessly integrated into existing systems while at the same time offering room for technological development.
The nitrogen flooding of FOUPs for 300 mm wafers involves flushing the transport container to prevent oxidation and particle contamination. In EFEMs, a laminar flow is generated, which coils particles downwards within the EFEM module and thus ensures that there are no particles on the wafer.
Our products: highly efficient valves with piezo technology such as VEAD, VEFC, VEMD.
The lock between the atmospheric area and the high vacuum, referred to as the load lock; at atmospheric pressure, a wafer is inserted, evacuated, and then placed in the transfer comb. Finished processed wafers are also returned to the EFEM in this way. To do this, air is gently admitted into the load lock again. Festo valves control the regeneration process precisely along specified pressure curves. This prevents turbulence and heat stresses, while reducing mechanical loads.
Recommended products: flow controller VEAD, mass flow controller VEFC
Festo relies on an "inverted gantry" for wafer handling between FOUP and load-lock. This Cartesian robot ensures safe and fast movement of the wafers in an atmospheric environment. The solution is space-saving and ideal for integration into existing EFEMs.
Recommended products: electric axis ELGD
Each process chamber has one or more associated gas boxes. This is the part of the system in which the required process gases are controlled or gas mixtures are produced using high-purity stainless steel valves.
Festo offers special valves for this application that meet the requirements for installation space, service life, and reproducibility of switching speeds.
In atomic layer deposition (ALD) systems, the demands on the gas valves are particularly high. The process always requires an identical sequence with maximum repeat accuracy within a few milliseconds: the introduction of the process gases, followed by flushing with inert gas. The high temperatures of the gaseous media place a high load on the valve technology. As the ideal solution for a repeatable and stable ALD process, the special MH2 quick-acting valve for pilot control of the media valves is approved for ambient temperatures up to 120 °C.
Recommended products: quick-action switching valve MH2
The wafer pin lift in a high vacuum enables low-vibration positioning of the wafer within the process chamber, either with one drive or with 3 synchronized drives. Positioning elements of the substrate can also be moved without vibrations with an accuracy down to one micrometer. The pneumatic solutions work with low vibration and thus avoid what is referred to as wafer walk. The advantage of Festo's solution is that the system recognizes the force required to lift the wafer from the ESC. This significantly reduces the risk of microcracks in the wafer or even complete wafer breakage. The pneumatic solution is more compact than electrical systems and it reduces the number of electrical components such as motors close to the chamber, because the required valve manifold and its control can be positioned at a greater distance from the process chamber.
Recommended products: valve manifold VTEP, controller CPX-E, sensor SDAT
The solution significantly reduces vibrations when opening and closing gate valves, also known as transfer or slit valves. The system allows smooth starting and braking without affecting the cycle time. Angle valves can also be controlled efficiently in this way.
The pedestal lift is used in coating systems in particular. The system ensures that the substrate or wafer in the process chamber is aligned in the correct position in relation to the plasma and showerhead.
In addition to electric solutions, we also offer the option of performing the alignment with a pneumatic drive. The advantage here is that pneumatic solutions generally have a smaller footprint and save on heat sources such as motor controllers or motors.
Having exactly the right temperature in each case is crucial in many semiconductor production processes. On the one hand, the electrostatic wafer chuck (ESC) must be heated precisely in order to bring the wafers to the required temperature for stable and safe processes. On the other hand, system components such as the plasma generator or process chamber require cooling in order to work reliably over the long term. The VZXA valve reliably regulates cooling and heating media between -80 °C and +100 °C. The valves can be used flexibly as individual valves or in customized valve blocks.
Recommended products: angle seat valve VZXA
Each process chamber, as well as the load-lock and the transfer chamber, have a cover that can be opened if required. It must be possible to open and close the cover safely for servicing or maintenance. Festo offers both electrical and pneumatic solutions that can be flexibly integrated into existing systems. Safety technology can be added if required.
Master the challenges of your semiconductor production with our tailor-made automation solutions for vacuum applications. This allows you to stabilize your current processes sustainably while increasing quality and cycle times and maximizing yield.
With our technologies, you can rely on quality that pays off amid the competition:
In our latest blog article "Reducing nitrogen consumption thanks to valves with piezo technology", you can find out how you can reduce nitrogen consumption by up to 75% when flushing FOUPs with VEFC and VEAD. These valves have been specially developed for dosing inert gases and offer advantages such as high dynamic response, low particle generation and a long service life.
In semiconductor production, high-vacuum processes and wafer front-end equipment (WFE) such as deposition, ion implantation, or dry etching require particularly high standards of purity, outgassing, and reliability. We offer specially developed automation solutions for this purpose: vacuum-compatible drives, valves, and handling systems that work precisely and safely even under extreme conditions – such as high temperatures or aggressive media. We offer low-particle components that can be flexibly integrated even in tight installation spaces. With our many years of experience in the semiconductor industry, we support you in designing efficient, reproducible, and fail-safe processes.
Safe handling of process gases is essential in high-vacuum processes. The gases involved are usually either corrosive or reactive and always harmful to health. As a rule, precise initiation with the best possible repeat accuracy is the key to the success of each process step. This applies regardless of whether it is a carrier gas, a cleaning gas, or the actual process gas for an etching process or a highly dynamic ALD (atomic layer deposition) process. Festo offers you the right solution for economical control of your pneumatic UHP valves, such as classic gas sticks or ALD valves for high-temperature applications. We have the right valve technology for every application.
The smart control of slit valves, gate valves, and transfer valves significantly reduces vibration in the tool while also reducing particle generation and particle stuttering. This also protects the valve's seal. In addition to slit and transfer valves, angle valves can also be controlled pneumatically. Another important application is the regeneration of vacuum chambers, such as load locks. Festo's economical Mass Flow Controllers (MFC) for inert gases regenerate reliably and gently.
Whether 300 mm silicon wafers, 150/200 mm SiC wafers or panels in advanced packaging – we offer specialized solutions for handling substrates. A central application is our pneumatic pin lift for high-vacuum chambers. This allows wafers to be moved gently end-to-end or positioned in the process at micrometer level – with controlled force, minimal energy input, and without additional motor controllers near the chamber. Other solutions include pedestal lifts and compact wafer end effectors with integrated aligners for precise alignment in confined spaces.
Precise temperature control of process gases, substrates, and process components is crucial for the quality of coating and etching processes. Rising temperatures are presenting semiconductor manufacturers with growing challenges. We offer intelligent temperature control solutions with which, for example, wafer chucks (electrostatic chucks / ESC), process chambers, or even plasma sources or RF generators can be cooled or temperature-controlled safely and efficiently. Our systems enable reliable temperature control – delivering stable processes, higher yields, and longer service lives for your systems.