Atmospheric processes in semiconductor production

Festo relies on an "inverted gantry" for wafer handling between FOUP and Load-Lock. This Cartesian robot ensures safe and fast movement of the wafers in an atmospheric environment. The solution is space-saving and can also be integrated into existing EFEMs.

Recommended products:
Electric axis ELGD

Our globally unique wafer aligner combines end effector and aligner in one compact system. It scores points with its gentle handling, optimum reproducibility and extremely low footprint. Our automation solution positions the wafer directly on the fork, recognizes markings such as notches, aligns the wafer accordingly, and loads it into the process chamber with pinpoint accuracy. This combination of several steps in one module reduces cycle times, the EFEM consumes significantly less space, and the number of wafer picks, i.e., how often the wafer is picked up and put down, is reduced. The non-contact alignment is achieved using the Bernoulli effect. This means that the wafer can also be turned ("flipped") and inserted upside down into the process.

The pin lift for wafers enables precise and vibration-free positioning of the wafer with an accuracy down to one micrometer. End-to-end movement of the substrate without vibrations is also possible in order to avoid what is called wafer walk. A major advantage is that the system recognizes the force required to lift the wafer, e.g., from an electrostatic wafer chuck (ESC). This significantly reduces the risk of microcracks in the wafer or even complete wafer breakage. The pneumatic solution is more compact than electrical systems, reduces electrical components such as motors and motor controllers, and therefore also heat radiation, because the regulators do not have to be positioned directly next to the process chamber. Specialized drives for high vacuum can also be controlled with Festo regulators.

The system generates and supplies data that can be used to monitor the status of the system. To do this, it is possible to use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as an entire, personalized system.

Recommended products:
Valve manifold VTEP
Controller CPX-E
Sensor SDAT

Our N2 purge solutions for creating and maintaining clean atmospheres reliably prevent oxidation by atmospheric oxygen and contamination by airborne particles. You will find the right system for every application, from low to high flow rates, e.g. for FOUPs. Our portfolio includes mass flow controllers (MFC) as single-channel and valve manifolds with several MFCs as a multi-channel solution. For EFEMs, SMIF/FOUP stockers or die banks, we offer purge solutions with a particularly compact footprint. The system generates data that can be used to monitor the condition of the system, in particular the degree of contamination of the filters used. Avoid unplanned machine downtime and further optimize your process.

Recommended products:
Our mass flow controllers VEMD, VEAD, VEFC, VTEP

When coating substrates with photoresists (PR), which can be cost-intensive among other things, our activation systems for dosing valves ensure precise coating thicknesses. And as a result, stable and reproducible process quality and optimum cost-effectiveness. The suck-back function prevents droplets from getting stuck on the outside of the nozzle tip. Our valves ensure precise PR dispensing and sucking back of the last drop, protecting the sensitive media from the oxygen in the air.

Recommended products:
Dosing valves VEAB and VTEP
Media-separated solenoid valves VYKA/ VYKC
Electric drives EPCO and ERMO as well as corresponding sensors

Our valves and sensors control the process media in the sub-fab, the hook-up and the WFE/tool with high precision and efficiency. Regardless of whether slurry with abrasive particles, wet chemicals such as acids or alkalis, DI water, or solvents – regardless of whether the installation is in a dry box, a control cabinet, or directly on the tool – and regardless of whether your focus is on minimized footprint, particle purity, fast switching times, or special environmental requirements such as high temperature or chemical loads: Festo offers reliable valve and control solutions for every application – for long-lasting semiconductor production in a reliable process.

Our systems can generate data that you can use to monitor the status of the system. To do this, it is possible to use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as an entire, personalized system.

Recommended products:
Valves VTOC, MH1, MHA2 and VUVG/ VTUX
Sensors SPTE, SPAN and SPAF

Pneumatic drives are used in what is called the bowl lift to separate liquid process media, reuse them, or dispose of them in a controlled manner. The respective collecting containers ("bowls") are positioned precisely and held securely depending on the medium or required spraying height. At the same time, the system helps to significantly reduce vibrations and shocks during system operation.

Our systems can generate data that you can use to monitor the status of the system. To do this, it is possible to use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as an entire, personalized system.

Recommended products:
Valve manifold VTEP
Cylinder DFM
Controller CPX-E
Sensor SDAT

In Chemical Mechanical Polishing (CMP), our pneumatic control ensures a dynamic and highly precise press force between the wafer and lapping table. The piezo valves regulate the pressure in real time and enable the wafers to be pressed on and lifted off particularly gently. In conjunction with our pressure sensors, the valves enable particularly high accuracy.

Recommended products:
Piezo valves VTEP and VEAB
ressure sensor SPAN
Media separated solenoid valve VYKC

In wet process systems such as spin cleaners or coater lines, it is important that the door to the process chamber works reliably. Particularly important in the cleanroom: It must reliably protect the wafers from contamination even under unexpected conditions – such as a power or air supply failure – and must not itself be a source of particles. Our door shutter solutions include reliable and precise round cylinders with special lubricants for automated opening and closing. Our pneumatic interlock systems also ensure secure interlocks. The sensors used provide reliable feedback on the position.

Recommended products:
Round cylinder DSNU
Interlock systems VOFA, VTOC, MH1, VUVG/ VTUG, VTUX
Sensors SPTE, SPAN and SPAF

We offer numerous special solutions for handling FOUPs, SMIF pods, substrates, and reticles in highly automated semiconductor factories. With our inverted gantry system, we implement space-saving and economical movements in the EFEM, while our innovative wafer aligner accelerates the loading process through integrated alignment and thus shortens cycle times. For FOUPs, we supply high-performance N2 purge systems with precise control, optionally as a single or multi-channel solution, which helps you to reduce the number of I/Os or operate several MFCs with one bus module. We also develop compact purge systems for SMIF/FOUP stoppers or die banks that precisely control even low flow rates and ensure a pure protective atmosphere.

We offer special solutions for wet processes such as PR coating, development, strip, or SpinClean. Our solutions, such as valves and sensors, control your high-purity valves made of PFA, PTFE, PVDV, or PP or your ultra-high-purity valves made of stainless steel with high precision and efficiency, and you also benefit from a long service life thanks to the particularly gentle control. Our systems can generate data that you can use to monitor the status of the system. To do this, it is possible to use existing algorithms from the Festo AI tool "Festo AX" and integrate them into your system as individual modules or as an entire, personalized system.
Whether installation in a dry box, control cabinet, or directly on the tool, whether your focus is on a minimized footprint, particle purity, fast switching times, special environmental requirements such as high temperature or chemical loads, we offer the right solution for every application. Dispense aggressive chemicals, while valves with a suck-back function prevent dripping during PR dispensing and ensure exact media quantities. For SpinCleaning processes, we supply pneumatic drives that control the bowl lift and move the splash guard or media separator continuously into the required position. In this way, we support safe, efficient, and contamination-free process management. And thus make a small contribution to a sustainable production process. By using innovative valve technology, you can save electrical energy directly with Festo and thus reduce your carbon footprint. We will be happy to accompany you on your way to becoming a "green fab".

We offer special solutions for CMP processes that require maximum precision and dynamics, especially in advanced packaging. Our high-precision piezo valves enable exact control of the contact pressure – crucial for controlled and even material removal. In this way, we not only support process quality and the minimization of rejects, but also help to shorten your process times. We also develop solutions that improve the efficiency and availability of CMP systems, for example in conjunction with conditioner pads or intelligent automation components.

We offer comprehensive solutions for the automation of all areas and process steps in the semicon fab. In innovative plants, for example, we support technological advances with our research and our pioneering products. In the sub-fab, we ensure a reliable supply of media and stable processes such as the treatment of waste water or waste gases. From precise valves and intelligent drives to complete handling systems, our automation solutions reliably help to make production processes more stable, faster, and more energy-efficient.

Use the data that our solutions generate and monitor the machine status or optimize your process – use the Festo AI solutions "Festo AX", either as a single module for a special application or as a personalized overall solution for your system.

Reduce energy consumption in your system and in the entire fab by using innovative Festo technology. Save twice with us! Reduce the power consumption of your system and optimize the consumption of compressed air/CDA and inert gases. We accompany you on your mission to reduce your carbon footprint.

We offer innovative solutions for advanced packaging, which plays a central role in modern chiplets such as HBM. For processes such as flip-chip or fusion/hybrid bonding, we supply precise handling actuators to prevent "squeeze-outs" in adhesive bonding. Benefit from precise actuators with which you can realize precise movements with accuracy down to 1 µm.
Measure the bending of wafers (warped wafers) and pull them onto your chuck.

Monitor the processes and machine status with Festo AX. Benefit from innovative Festo technology in your fusion/hybrid bonder while increasing process reliability and quality in demanding advanced packaging.