Semiconductor manufacturing training solutions

Everything starts with high-purity silicon ingots, typically produced in a specialized manufacturing plant through a process called the Czochralski method and sold to semiconductor foundries and fabs.

In wafer fabrication, silicon ingots are sliced into thin, circular wafers. These wafers are then polished to create smooth surfaces. Machines called wafer sawing machines are used to slice the ingots, while lapping machines and polishing machines are used to polish the wafers.

A thin layer of silicon dioxide is grown on the surface of silicon wafers. This layer acts as insulation and helps in later steps of the manufacturing process. This is done using special furnaces called oxidation furnaces.

This step defines the circuit layout on the wafer. A light-sensitive material called photoresist is applied to the wafer, and then a pattern is projected onto it using a special machine called a photolithography stepper. This machine works like a projector but with very precise control. Mask alignment systems are used to ensure precision and consistency.

Etching selectively removes material from the wafer surface based on the patterned photoresist. This step defines the features of the semiconductor device. There are different types of etching machines: wet etchers that use chemical solutions or dry etchers that use gases or plasma.

The photolithography and etching processes are repeated on each of the waffer's layers.

Deposition adds thin layers of materials onto the wafer surface to build up the circuits and create desired features. Chemical vapor deposition (CVD) systems introduce precursor gases into a reaction chamber, where they react to form a thin film. Physical vapor deposition (PVD) systems use physical methods (such as evaporation or sputtering) to deposit material onto the wafer surface.

Then, doping introduces impurities into the semiconductor material to modify its electrical properties. Ion implantation is a common doping method. Ion implanters accelerate ions into the wafer surface to implant dopants at specific depths. Diffusion furnaces heat the wafer in the presence of dopant gases to diffuse dopants into the semiconductor material.

Also called metallization, this step involves adding metal layers onto the wafer to connect the different components of the circuit and provide a path for the current to flow. This is done using deposition systems, similar to those used in deposition. Once the metal is deposited, it is patterned using photolithography to create the wires.

Electronics components like capacitors, transistors, resistors, and diodes can be integrated into semiconductor devices during the fabrication process through various steps, depending on the type of semiconductor device being manufactured.

Semiconductor devices are separated, packaged, and tested to ensure functionality and reliability. Die bonders attach individual chips to packaging substrates, wire bonders connect chips to package leads, encapsulation equipment seals chips in protective materials, and test systems perform electrical testing to verify device performance. Electric die sorting (EDS) machines are used to test the electrical characteristics of each chip and sort them based on their performance.

An onboarding program for new hires in the semiconductor manufacturing industry should cover essential topics to provide a comprehensive understanding of semiconductor fundamentals and manufacturing processes.

An introduction to semiconductor physics, including concepts such as band theory, doping, and carrier mobility, and a review of the semiconductor industry's value chain set the foundation. Next, an overview of semiconductor materials, device structures, and device characteristics helps new hires grasp the basics.

Moving forward, an exploration of semiconductor manufacturing processes, including photolithography, etching, deposition, and packaging, provides insight into the intricacies of production. An introduction to related equipment operation, maintenance, and metrology tools ensures familiarity with tools of the trade.

Cleanroom protocol and safety standards are crucial components, emphasizing the importance of contamination control and workplace safety. Quality control principles and data analysis techniques round out the program, emphasizing the importance of product quality and process optimization.

Through these main topics, new hires gain a solid understanding of semiconductor manufacturing, preparing them for success in the industry.

Semiconductor manufacturing is characterized by digitalization, serving as the foundation for Industry 4.0 technologies such as the Industrial Internet of Things (IIoT), cyber-physical systems, additive manufacturing, augmented reality (AR), virtual reality (VR), artificial intelligence (AI), big data analytics, and other advanced innovations. In this context, factory automation technologies optimize production processes and enhance operational efficiency.

Mechatronics, a multidisciplinary field combining mechanical, electrical, and computer engineering, is essential for understanding and maintaining the complex machinery and robotic systems utilized in semiconductor fabrication. Furthermore, as manufacturing facilities transition toward interconnected production lines, workers need expertise in networking technologies to ensure seamless communication and coordination between equipment and systems. MES platforms play a pivotal role in optimizing production processes, scheduling, and resource allocation, requiring workers to be proficient in their operation and utilization.

Additionally, with energy efficiency becoming increasingly important, workers must have knowledge of energy management principles, particularly in areas such as electrical systems and compressed air usage, to minimize energy consumption and reduce environmental impact in semiconductor manufacturing facilities.

Robots, both industrial and mobile, have become integral components of the modern fab environment.

Industrial robots handle silicon wafers throughout the manufacturing process. They are employed in semiconductor assembly and packaging operations to pick and place components with high precision. Industrial robots assist in etching and deposition processes by precisely positioning substrates and masks in process chambers. They are utilized in metrology and inspection, and even cleanroom maintenance. Depending on the task, various robots are used: articulated, cartesian, collaborative (cobots), and more.

Autonomous or semi-autonomous mobile robots are also employed for material handling (transport materials, components, or finished products between different areas of the manufacturing facility), inventory management (tracking and locating semiconductor wafers, components, or tools) and inspection tasks.

PLCs are widely used in semiconductor manufacturing equipment to control and coordinate various processes. Proficiency in PLC skills is essential for individuals working in industrial automation, manufacturing, and process control, enabling them to effectively program, operate, and maintain PLC systems to optimize production processes and ensure the smooth operation of industrial facilities.

Understanding PLC hardware components is essential for selecting, installing, configuring, and troubleshooting PLC systems. Proficiency in PLC programming languages is vital for developing, testing, and debugging PLC programs using professional programming software. Additionally, integrating safety features into PLC programs, such as emergency stop circuits, interlocks, and safety-rated relays, is crucial.

Since PLCs are often interconnected within an industrial network, workers must also comprehend how PLCs interface with various manufacturing equipment and systems in semiconductor fabs. This includes understanding sensor technologies, actuator types, communication protocols, and data exchange mechanisms used to integrate PLCs with equipment such as robots, vacuum chambers, chemical delivery systems, and metrology tools. Configuration of PLC communication interfaces, setup of network connections, and troubleshooting communication issues require a solid understanding of industrial communication protocols.

Furthermore, workers should be capable of collecting, processing, and analyzing data generated by PLCs to monitor process performance, identify deviations, and optimize production processes.

Electrical systems play a vital role in powering, controlling, and monitoring semiconductor manufacturing equipment and processes.

All technicians need a solid understanding of the basics of electrical engineering and electronics: electrical principles, including voltage, current, resistance, power, and circuits. Training on electrical safety practices, including lockout/tagout procedures, proper use of personal protective equipment (PPE), and precautions for working with high voltage equipment is paramount.

Electric motors are widely used in equipment and systems in semiconductor manufacturing due to their efficiency, precision, and reliability. Their ability to deliver consistent performance, coupled with low maintenance requirements, makes electric motors a preferred choice for powering critical equipment such as robotic arms, conveyor systems, vacuum pumps, and wafer handling systems in semiconductor manufacturing facilities.

Electric motor control enables efficiency, precision, reliability, and safety across production processes. Various means can regulate their speed, torque, direction, and position: basic technologies such as relays, stepper and servo motor drives, variable-frequency drives, PLCs...

Electronics skills are indispensable for the semiconductor manufacturing workforce, as it enables them to grasp the underlying principles of semiconductor technology, optimize manufacturing processes, operate sophisticated equipment, and troubleshoot and repair, even on circuit boards. Proficiency in circuit theory, power electronics, analog electronics, and digital electronics is particularly relevant in semiconductor manufacturing, where intricate electronic components and systems are used in production equipment.

Pneumatic and electropneumatic components are commonly used in semiconductor manufacturing equipment for various purposes, including actuation, control, and manipulation. Vacuum technology ensures the alignment and stability of wafers during photolithography and etching processes. Pneumatic pumps and valves ensure consistent and precise delivery of gases and chemicals.

Given the need for high precision, complex automation, and data-driven optimization in semiconductor manufacturing, digital pneumatics—pneumatic components equipped with digital control technology—offer enhanced functionality, precise control, and communication capabilities.

These technologies enable cost-effective, high-performance solutions with rapid response times, simple installation and maintenance, cleanliness, and adaptability. Additionally, pneumatic systems are inherently non-sparking and intrinsically safe, making them suitable for use in hazardous environments commonly found in semiconductor manufacturing facilities.

Sensors play a critical role in monitoring, controlling, and optimizing various processes, equipment, and environments to ensure the production of high-quality semiconductors. Sensors monitor temperature, pressure, flow, level, optical properties, vibration, position, and more, providing real-time feedback on process conditions. This enables operators to maintain optimal parameters and promptly detect any deviations that could impact product quality.

In recent years, smart sensors and seamless integration into industrial control systems have elevated automation to new levels, offering enhanced efficiency, improved accuracy, and reliability.

Although semiconductor fabs are highly automated and high-tech environments, basic skills are required to work with equipment and systems:

Pumps and piping systems are integral components of semiconductor manufacturing facilities, working together to facilitate various processes and operations, such as chemicals and gas delivery, cooling, vacuum generation, and waste management.

Mechanical drive systems rely on components (belts, chains, gears...) that transmit power and motion from motors to moving parts within semiconductor processing equipment.

Industrial electrical wiring plays a critical role in providing power and connectivity to various equipment, machinery, and systems, ensuring reliable and efficient operation.

Basic dimensional metrology and proper use of common hand tools are essential for efficient maintenance and repair tasks on production equipment and machinery.

In semiconductor manufacturing, heating, ventilation, air conditioning (HVAC), and refrigeration systems play a critical role in maintaining the precise environmental conditions necessary for high-quality production. These systems ensure proper control of temperature, humidity, and air quality, all of which are essential for the manufacturing process.

Technical workers must be proficient in using monitoring tools to track these metrics. Their technical aptitude must extend to understanding HVAC control systems and how these systems integrate with other facility systems and processes. They must also understand basic refrigeration concepts, such as thermodynamics fundamentals and the refrigeration cycle.

Semiconductor manufacturing requires a variety of process instrumentation and control instrumentation to ensure precise control, monitoring, and optimization of the process variables such as flow, level, pressure, temperature, pH, and conductivity. Commonly used are pressure and temperature flow meters, pH sensors, and pressure controllers. Transmitters, valves, and other field devices are important components of process loops.

Supervisory Control and Data Acquisition (SCADA) and Distributed Control Systems (DCS) are examples of automated control systems adjust process parameters based on feedback from instrumentation sensors to maintain desired conditions and achieve consistent semiconductor quality. These systems regulate gas flow rates, chemical dosages, and equipment settings with high accuracy and repeatability. SCADA systems typically provide real-time monitoring and visualization of process data, while DCS systems offer centralized control and coordination of process equipment and operations.

Semiconductor manufacturing relies heavily on ultra-pure water with minimal contaminants. Ultra-Pure Water (UPW) systems employ advanced purification methods like reverse osmosis, deionization, and filtration to meet stringent quality standards. This purified water is integral to various manufacturing processes, including wafer cleaning, chemical mixing, and rinsing. Maintaining the quality and quantity of process water is paramount for consistent and dependable fabrication procedures.

Additionally, water serves as a crucial coolant, safeguarding equipment against overheating and ensuring optimal performance. Given that semiconductor manufacturing generates wastewater containing diverse chemicals and contaminants, effective treatment processes are essential before discharge, recycling, or reuse. This approach minimizes water consumption and environmental impact, aligning with sustainable manufacturing practices.

Operational excellence and quality are critical pillars of semiconductor manufacturing, necessitating a thorough understanding of various principles to ensure efficiency, reliability, and product excellence.

Comprehending lean production concepts, including waste reduction, continuous improvement, and value stream mapping, empowers workers to optimize processes and eradicate inefficiencies throughout semiconductor manufacturing.

Proficiency in statistical process control (SPC) techniques equips workers to vigilantly monitor and manage manufacturing processes, maintaining consistency and swiftly identifying deviations that could compromise product quality.

Knowledge of total productive maintenance (TPM) principles is indispensable for guaranteeing equipment reliability, minimizing downtime, and maximizing overall equipment effectiveness (OEE) in semiconductor manufacturing facilities.

Moreover, proficiency in additional topics such as Poka Yoke, 5S workstation organization, value stream analysis and mapping, and Six Sigma methodologies further enriches workers' skill sets and enhances manufacturing operations.

Providing equipment that mirrors the environment found in semiconductor fabs ensures that students are familiar with industry-standard machinery and technology.

Offering practical exercises, experiments, and projects that simulate real-world manufacturing scenarios allows students to gain valuable hands-on experience.

Utilizing multimedia courses, simulation tools, virtual labs, and augmented reality applications enhances the learning experience, caters to different learning styles, and facilitates understanding of complex concepts.

Adapting training to students from diverse backgrounds and with different career aspirations ensures that each individual receives tailored education suited to their needs and goals.

Tracking students' progress, identifying areas for improvement, and providing guidance and support throughout the training program ensures that students are continuously developing their skills.

Emphasizing the development of soft skills such as communication, teamwork, and adaptability is essential for success in the collaborative and fast-paced environment of semiconductor manufacturing.